Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication

ABSTRACT

A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/015,578, filed Feb. 4, 2016, which is a continuation of U.S. patentapplication Ser. No. 13/910,683, filed Jun. 5, 2013, now U.S. Pat. No.9,257,320.

TECHNICAL FIELD

The technical field generally relates to wafer carrier purgeapparatuses, automated mechanical handling systems (AMHSs) including thewafer carrier purge apparatuses, and methods of handling a wafer carrierduring integrated circuit fabrication. More particularly, the technicalfield relates to wafer carrier purge apparatuses, AMHSs, and methods ofhandling the wafer carriers that enable gas to be introduced into andcaptured from the wafer carriers while the wafer carriers are disposedin carrier storage positions in the AMHSs during integrated circuitfabrication.

BACKGROUND

Automated mechanical handling systems (AMHSs) are widely used duringintegrated circuit fabrication to organize, handle, and track suppliedwafers in a fabrication facility to use in fabrication of integratedcircuits in the most efficient manner possible. AMHSs generally employcarrier storage positions, e.g., storage positions in a stocker or zerofootprint storage bins. The carrier storage positions are adapted toreceive a wafer carrier, such as a front opening shipping box (FOSB).The AMHSs also generally include a container transporter that is adaptedto move the FOSBs into and out of the carrier storage positions. Duringhandling, FOSBs that include the supplied wafers are removed from thecarrier storage positions and unwrapped, followed by placing thesupplied wafers and an empty front opening unified pod (FOUP) on asorter. The FOUP allows the supplied wafers to be accessed duringautomated integrated circuit fabrication. The supplied wafers aretransferred to the empty FOUP on the sorter. The FOUP is then generallyreturned to the carrier storage position, where the FOUP remains untilthe supplied wafers are needed.

Queue times during automated integrated circuit fabrication have asignificant impact on integrated circuit quality due to environmentalimpact on materials that are used to fabricate the integrated circuits.In particular, prolonged exposure to moisture or other airborneenvironmental contaminants such as organic compounds and ions can leadto corrosion and/or crystallization on the wafers, thereby resulting inout-of-specification integrated circuits that must be discarded orreworked. To avoid excessive queue times, fabrication facilities oftenemploy production holds at various stages in the fabrication to ensurethat queue times are not exceeded that would otherwise result in reworkand scrap of fabricated integrated circuits. Wafer Environment Control(WEC) solutions are another option that has been considered to preventcontamination of the supplied wafers from moisture and organic compoundsthat may be present in the ambient atmosphere surrounding the carrierstorage positions while the supplied wafers are stored. The WECsolutions, in principle, provide a chemically inert environmentsurrounding the supplied wafers while the supplied wafers await useduring integrated circuit fabrication, thereby rendering long queuetimes immaterial to product quality. However, existing WEC solutionsgenerally require additional process steps or major tool modifications,thereby rendering the WEC solutions impractical for implementation inexisting fabrication facilities.

Accordingly, it is desirable to provide apparatuses, systems forintegrated circuit fabrication, and methods that enable waferenvironment control to be readily implemented into existing processsteps without significant tool modification. Furthermore, otherdesirable features and characteristics of the present invention willbecome apparent from the subsequent detailed description of theinvention and the appended claims, taken in conjunction with theaccompanying drawings and this background of the invention.

BRIEF SUMMARY

A wafer carrier purge apparatus, an automated mechanical handling systemfor integrated circuit fabrication, and a method of handling a wafercarrier during integrated circuit fabrication are provided. In anembodiment, a wafer carrier purge apparatus includes a purge plate thatis adapted for insertion into a carrier storage position. The purgeplate includes a gas port and a gas nozzle in fluid communication withthe gas port. The gas port receives an gas flow. The gas nozzle isadapted to contact an inlet port of a wafer carrier for introducing agas into the wafer carrier. The purge plate further includes a vacuumport and a vacuum nozzle in fluid communication with the vacuum port,spaced from the gas nozzle. The vacuum nozzle is adapted to capture gasthat escapes from the wafer carrier through an outlet port of the wafercarrier. The purge plate is separate and removable from the carrierstorage position.

In another embodiment, an automated mechanical handling system isprovided for integrated circuit fabrication. The system includes aplurality of storage positions that are adapted to receive a wafercarrier. A container transporter is adapted to move the wafer carrierinto and out of the plurality of carrier storage positions. The systemfurther includes a wafer carrier purge apparatus that includes a purgeplate that is adapted for insertion into one of the plurality of carrierstorage positions. The purge plate includes a gas port and a gas nozzlein fluid communication with the gas port. The gas port receives a gasflow. The gas nozzle is adapted to contact an inlet port of a wafercarrier for introducing gas into the wafer carrier. The purge platefurther includes a vacuum port and a vacuum nozzle in fluidcommunication with the vacuum port, spaced from the gas nozzle. Thevacuum nozzle is adapted to capture gas from the wafer carrier throughan outlet port of the wafer carrier. The purge plate is separate andremovable from the carrier storage position.

In another embodiment, a method of handling a wafer carrier duringintegrated circuit fabrication is provided. The wafer carrier has aninlet port and an outlet port, and the method includes loading the wafercarrier into a carrier storage position. A plurality of the carrierstorage positions is provided, and a purge plate is disposed in eachcarrier storage position. The purge plate includes a gas port and a gasnozzle in fluid communication with the gas port. The gas port receives agas flow. The gas nozzle is adapted to contact the inlet port of a wafercarrier. The purge plate further includes a vacuum port and a vacuumnozzle in fluid communication with the vacuum port, spaced from the gasnozzle. The vacuum nozzle is adapted to capture gas that escapes fromthe wafer carrier through the outlet port of the wafer carrier. Thepresence of the wafer carrier is sensed in the carrier storage positionwith a presence sensor that is in electrical communication with acontrol module that is adapted to control gas flow through the gasnozzles and vacuum applied to the vacuum nozzles for at least two of thepurge plates. Gas flow is provided through the gas nozzle and vacuum isapplied to the vacuum nozzle for all purge plates that are controlled bythe control module upon sensing the presence of the wafer carrier in thecarrier storage position.

BRIEF DESCRIPTION OF THE DRAWINGS

The various embodiments will hereinafter be described in conjunctionwith the following drawing figures, wherein like numerals denote likeelements, and wherein:

FIG. 1 is an automated mechanical handling system in accordance with anembodiment;

FIG. 2 is perspective schematic view of a wafer carrier purge apparatusincluding a purge plate for use in the automated mechanical handlingsystem of FIG. 1 in accordance with an embodiment; and

FIG. 3 is a perspective schematic view of the purge plate of FIG. 2 inaccordance with an embodiment.

DETAILED DESCRIPTION

The following detailed description is merely exemplary in nature and isnot intended to limit the various embodiments or the application anduses thereof. Furthermore, there is no intention to be bound by anytheory presented in the preceding background or the following detaileddescription.

Automated mechanical handling systems, wafer carrier purge apparatuses,and methods of handling a wafer carrier during integrated circuitfabrication are provided herein. The wafer carrier purge apparatusesinclude a purge plate that is adapted for insertion into a carrierstorage position, e.g., a storage position of a stocker or a zerofootprint storage (ZFS) bin, and that is adapted to introduce gas intoand remove gaseous contents from a wafer carrier upon placing the wafercarrier in the carrier storage position. In particular, the purge platehas a gas nozzle that is adapted to contact an inlet port of the wafercarrier for introducing gas into the wafer carrier, and a vacuum nozzlethat is spaced from the gas nozzle and adapted to capture gas thatescapes from the wafer carrier through an outlet port of the wafercarrier. By providing the gas nozzle and the vacuum nozzle on the purgeplate, the gas nozzle and the vacuum nozzle are precisely pre-positionedto align with existing inlet and outlet ports in the wafer carrier. Thepurge plate is separate and removable from the carrier storage position,with placement of the purge plate within the carrier storage positionenabling simple retrofit of existing stockers or ZFS units with thewafer carrier purge apparatus. By “separate and removable”, it is meantthat the purge plate is not an integrated element of the carrier storageposition and can possibly be removed after installation while stillenabling the carrier storage position to function within the automatedmechanical handling system (i.e., without rendering the carrier storageposition inoperable and incapable of receiving the wafer carrier albeitwithout wafer carrier purging functionality). In an embodiment, thewafer carrier purge apparatus may be integrated into existing AMHSs,with the purge plate inserted and secured in the carrier storageposition to provide purging capabilities to the AMHS. Gas may becirculated through the wafer carrier while the wafer carrier is storedin the carrier storage position, thereby avoiding any need to addprocess steps to effectuate wafer environment control. With the gascirculation provided by the wafer carrier purge apparatus, the effect ofqueue times on integrated circuit quality can be minimized withmaximized product yields achieved.

An embodiment of an automated mechanical handling system (AMHS) 10 andan embodiment of a wafer carrier purge apparatus 32 that may be used inthe AMHS 10 will now be described with reference to FIGS. 1-3. In anembodiment and as shown in FIG. 1, the AMHS 10 includes a stocker 18that has a plurality of carrier storage positions 20, with the carrierstorage positions 20 adapted to receive a wafer carrier 15 that includessupplied wafers 25. As referred to herein, the wafer carrier 15 ofinterest is also known in the art as a front opening unified pod (FOUP)and is the container to which the supplied wafers 25 are transferred andwithin which the supplied wafers 25 remain until a production lotstart26 is ready to receive the wafer carrier 15. However, in otherembodiments, it is to be appreciated that carrier storage positions maybe ZFS bins or may also be adapted to receive other types of containerssuch as front opening shipping boxes (FOSBs), which contain suppliedwafers 25 that are provided directly from a supplier and which may bestored until the supplied wafers 25 are ready to be transferred to theFOUP 15 in accordance with convention waferstart process flows. Thewafer carrier 15 includes an inlet port 22 and an outlet port 28 forenabling gases to be introduced into and removed from the wafer carrier15, thereby facilitating purging with the wafer carrier purge apparatus32. The stocker 18 stores and maintains the wafer carriers 15 in thecarrier storage positions 20 to enable organization and storage of thewafer carriers 15 until the production lotstart 26 is ready to receivethe supplied wafers 25. A container transporter 24 is adapted to movethe wafer carrier 15 into and out of the plurality of carrier storagepositions 20 in the stocker 18.

The AMHS 10 may further include a system computer 12 that includes adata input interface 14 and a storage medium 16 for registering suppliedwafers 25 and tracking locations of the supplied wafers 25 through thefabrication facility. The data input interface 14 can be a userinterface, such as a keyboard and visual display, for manually enteringdata into the system computer 12. Alternatively, the data inputinterface 14 can be an interface that enables electronic transfer ofdata into the system computer 12 from an external source, e.g., a USBport, wireless or wired network connection that is open to receiving thedata, and the like. The container transporter 24 may be controlled bythe system computer 12, with the system computer 12 adapted to controlmovement of the wafer carriers 15 into and out of the plurality ofcarrier storage positions 20 in the stocker 18 using the containertransporter 24.

In an embodiment and as shown in FIG. 1, the AMHS 10 further includesthe wafer carrier purge apparatus 32. However, it is to be appreciatedthat in other embodiments, the wafer carrier purge apparatus 32 isprovided independent of the AMHS 10 and may be provided for modificationof existing AMHSs. Referring to FIG. 1, the wafer carrier purgeapparatus 32 includes a purge plate 34 that is adapted for insertioninto one of the plurality of carrier storage positions 20. The purgeplate 34 is separate and removable from the carrier storage position 20of the stocker 18 within which the purge plate 34 is inserted during usein the AMHS 10. However, the purge plate 34 may be secured to thecarrier storage position 20 to precisely position the purge plate 34 ina proper location where the container transporter 24 is configured toplace the wafer carrier 15 in the carrier storage position 20. In anembodiment and as shown in FIG. 2, the purge plate 34 includes afastening feature 36 to facilitate attachment of the purge plate 34 tothe carrier storage position 20 of the stocker 18. For example, thefastening feature 36 may be a bore or groove 36 that receives a bolt(not shown) for fastening the purge plate 34 to the stocker 18.Alternatively, in other embodiments and although not shown, thefastening feature can be a mating tab, latch, magnet, or other featurethat enables precise placement of the purge plate 34 in the carrierstorage positions 20 and that maintains the purge plate 34 in place.

Referring to FIG. 2, the purge plate 34 includes a gas port 38 forreceiving a gas flow. The gas that is provided to the purge plate 34 canbe any gas that is generally unreactive under ambient conditions, suchas a noble gas or nitrogen. Alternatively, the gas that is provided tothe purge plate 34 may be clean, dry air. In a specific embodiment, thegas is nitrogen. The gas provided through the port may be substantiallypure inert gas, e.g., 99 weight % pure inert gas such as nitrogen, ormay be a mixture of gases. The purge plate 34 further include a gasnozzle 40 that is in fluid communication with the gas port 38 and thatis adapted to contact the inlet port of the wafer carrier forintroducing gas into the wafer carrier. The gas nozzle 40 may have anyconfiguration that enables a physical seal to be formed between the gasnozzle 40 and the inlet port of the wafer carrier. For example, the gasnozzle 40 may provide a mating connection with the inlet port of thewafer carrier, or may provide a connection that is designed to seal withthe inlet port upon the wafer carrier being placed on the purge plate34. As a specific example and as shown in FIG. 2, a gasket 42 may bedisposed about the gas nozzle 40 to seal the connection between the gasnozzle 40 and the inlet port of the wafer carrier when the wafer carrieris disposed on the purge plate 34.

In an embodiment and as shown in FIG. 2, a pressure sensor 44 may bedisposed between and in fluid communication with the gas port 38 and thegas nozzle 40 to monitor flow of gas between the gas port 38 and the gasnozzle 40. In particular, a fluid channel of the pressure sensor 44 maybe in fluid communication with a fluid channel between the gas port 38and the gas nozzle 40 to provide a measurement location for the fluidsensor between the gas port 38 and the gas nozzle 40. The pressuresensor 44 may be employed to assist with detecting whether properalignment of the inlet port of the wafer carrier and the gas nozzle 40has been achieved. In particular, a pressure buildup sensed by thepressure sensor 44 may be an indication that the gas nozzle 40 isblocked and that gas is not flowing into the inlet port of the wafercarrier, which could result in failure to effectively purge the wafercarrier.

As shown in FIG. 2, the purge plate 34 further includes a vacuum port 46and a vacuum nozzle 48 that is in fluid communication with the vacuumport 46. The vacuum nozzle 48 is spaced from the gas nozzle 40, and thevacuum nozzle is adapted to capture gas that escapes from the wafercarrier through the outlet port 28 of the wafer carrier. In this regard,the vacuum port 46 enables circulation of the gas that is provided tothe wafer carrier from the gas nozzle 40 through the inlet port of thewafer carrier and out through the outlet port and the vacuum nozzle 48under the influence of vacuum applied to the vacuum nozzle 48 throughthe vacuum port 46. Whereas a seal between the gas nozzle 40 and theinlet port of the wafer carrier is generally established, the purgeplate 34 may define a pressure relief feature 50 that is in fluidcommunication with the vacuum nozzle 48 and the vacuum port 46 toprevent sealing between the vacuum nozzle 48 and the wafer carrier. Thepressure relief feature 50 enables gas to be captured from the wafercarrier as it escapes through the outlet port without evacuating thewafer carrier and without rendering separation of the wafer carrier fromthe purge plate 34 difficult. In an embodiment and as shown in FIG. 2,the pressure relief feature 50 may be a gap that extends across thevacuum nozzle 48 and that allows ambient air from outside of the wafercarrier to pass into the vacuum nozzle 48 when the outlet port of thewafer carrier is disposed on the vacuum nozzle 48. However, although notshown, it is to be appreciated that other pressure relief features maybe employed such as, for example, a pressure relief valve disposedbetween the vacuum nozzle 48 and the vacuum port 46.

The purge plate 34 may have various features to ensure that properalignment is achieved between the wafer carrier and the purge plate 34.For example, as shown in FIG. 2, the purge plate 34 may have an integralstructure 52 that connects the gas port 38, the gas nozzle 40, thevacuum port 46, and the vacuum nozzle 48, i.e., the purge plate 34 mayhave a one-piece construction. In this manner, constant and precisespacing may be maintained between the gas nozzle 40 and the vacuumnozzle 48. Additionally and referring to FIG. 2, the purge plate 34 isadapted to receive the wafer carrier on a contact surface 56, and thegas nozzle 40 and the vacuum nozzle 48 are both located on the contactsurface 56. The contact surface 56, as referred to herein, is thesurface of the purge plate 34 that physically contacts the wafer carrierwhen the wafer carrier is disposed in the carrier storage position. Inan embodiment, the purge plate 34 includes an alignment feature 54 thatis disposed on the contact surface 56 of the purge plate 34 for aligningthe inlet port and the outlet port 28 of the wafer carrier with the gasnozzle 40 and the vacuum nozzle 48, respectively. It is to beappreciated that various alignment features are known in the art,including alignment features that enable alignment through a matingconfiguration, magnetic attraction, and the like. For example and asshown in FIG. 2, the alignment feature 54 may include one or morekinematic pins that are precisely positioned to mate with correspondinggrooves (not shown) in the wafer carrier.

In an embodiment and as shown in FIG. 1, the purge plate 34 isconfigured to be disposed on a bottom surface of the carrier storageposition 20, with the contact surface 56 facing into the carrier storageposition 20 and with the wafer carrier 15 resting on the contact surface56 of the purge plate 34 upon placement into the carrier storageposition 20. With the purge plate 34 disposed on the bottom surface ofthe carrier storage position 20, gravitational forces may be sufficientto adequately maintain connection between the inlet port 22 of the wafercarrier 15 and the gas nozzle of the purge plate 34.

In an embodiment and referring again to FIG. 2, a presence sensor 58 isdisposed on the contact surface 56 of the purge plate 34 for registeringa presence or absence of the carrier wafer in the carrier storageposition 20. The presence sensor 58 may function through any sensingmechanism, such as optical or physical sensing mechanisms. For example,in an embodiment, the presence sensor 58 includes a photoelectric sensor58. In an embodiment, the presence sensor 58 is employed to provide abinary output correlated to either the presence or the absence of thewafer carrier in the carrier storage position 20, as described infurther detail below in accordance with an exemplary method of handlingthe wafer carrier during integrated circuit fabrication.

In an embodiment and as shown in FIG. 3, the wafer carrier purgeapparatus 32 further includes a control module 62, an gas manifold 64 influid communication with the gas port 38, and a vacuum manifold 66 influid communication with the vacuum port 46. The control module 62 isadapted to control fluid flow in the gas manifold 64 and the vacuummanifold 66. In this embodiment, the wafer carrier purge apparatus 32may include an additional purge plate 34, with the gas manifold 64 andthe vacuum manifold 66 in fluid communication with the gas port 38 andthe vacuum port 46 of each of the purge plates 34. The presence sensorsmay be in electrical communication with the control module 62, with thecontrol module 62 adapted to control gas flow through the gas nozzlesand vacuum applied to the vacuum nozzles for the purge plates 34.

In an embodiment and referring again to FIG. 2, a flow regulator 60 isdisposed between and in fluid communication with the gas port 38 and thegas nozzle 40 to influence flow of the gas from the gas port 38 throughthe gas nozzle 40. The flow regulator 60 may be any element thatinfluences flow of the gas through the gas nozzle 40, such as a criticalorifice 60, flow control valve or the like. In an embodiment, the flowregulator 60 only influences flow of the gas through the gas nozzle 40,but does not stop flow. For example, in an embodiment, the flowregulator 60 is the critical orifice 60. The critical orifice 60 may bea region of a flow channel for the gas that has a lesser inner diameterthan upstream and downstream portions of the flow channel. When adifference in pressure between downstream and upstream portions of theflow channel relative to the critical orifice 60 reaches a thresholdvalue, velocity of the gas through the orifice reaches the speed ofsound and no further increase in flow rate will generally occur, i.e.,the flow becomes “critical”. The critical orifice 60 may be employed toprovide a steady supply of gas through the gas nozzle 40 upon a wafercarrier being sensed on the purge plate 34, and a plurality of the purgeplate 34 may be connected in parallel to a single gas source thatprovides the gas at a sufficiently high pressure to maintain gas flowthrough all of the critical orifices of the purge plates 34. In afurther embodiment and referring to FIG. 3, the wafer carrier purgeapparatus 32 is free from shutoff valves that are disposed between thegas manifold 64 and the gas nozzle 40 and between the vacuum manifold 66and the vacuum nozzle 48. In this manner, only the control module 62controls gas flow and vacuum.

An embodiment of a method of handling a wafer carrier during integratedcircuit fabrication will now be described using the AMHS and wafercarrier purge apparatus 32 shown in FIGS. 1-3. In accordance with theexemplary method, safeguards are put in place to both ensure that gas isflowing to the wafer carrier 15 and that gas flow is properly ceasedwhen appropriate. In an embodiment of the exemplary method, a pluralityof the carrier storage positions 20 are provided with a purge plate 34disposed in each carrier storage position 20. A wafer carrier 15 isloaded into a carrier storage position 20, whereupon the presence of thewafer carrier 15 in the carrier storage position 20 is sensed with thepresence sensor 58. The presence sensor 58 is in electricalcommunication with the control module 62 for registering the presence orabsence of carrier wafers adjacent to any purge plate 34 that iscontrolled by the control module 62. Gas flow is then provided throughthe gas nozzle 40 and vacuum is applied to the vacuum nozzle 48 for allpurge plates 34 that are controlled by the control module 62 uponsensing the presence of the wafer carrier 15 in the carrier storageposition 20. In particular, even if the presence of only a single wafercarrier 15 is sensed adjacent to a single purge plate 34, withadditional purge plates 34 controlled by the control module 62registering the absence of a wafer carrier 15, the control module 62still directs gas flow and applies the vacuum for all of the purgeplates 34. Due to the use of the flow regulator 60, sufficient amountsof gas may be provided to each purge plate 34 in this embodiment toeffect purging without significant cost impact of wasted gas that ispassed to empty purge plates 34. It is to be appreciated that in otherembodiments of suitable methods, other schemes may be employed toselectively direct gas only to purge plates 34 where the presence of awafer carrier 15 is detected, although such methods may require morecomplex control modules and wafer carrier 15 purge apparatuses.

In an embodiment, the method further includes sensing flow of gasbetween the gas port 38 and the gas nozzle 40 using, e.g., the pressuresensor 44. By sensing flow of the gas between the gas port 38 and thegas nozzle 40, a determination can be made of whether the wafer carrier15 that is disposed adjacent to the purge plate 34 is being properlypurged. For example, a pressure buildup sensed by the pressure sensor 44may be an indication that the gas nozzle 40 is blocked and that gas isnot properly flowing into the inlet port 22 of the wafer carrier 15,which could result in failure to effectively purge the wafer carrier 15.In an embodiment, an error function is initiated using the controlmodule 62 upon sensing the presence of the wafer carrier 15 with thepresence sensor 58 and further upon sensing insufficient flow betweenthe gas port 38 and the gas nozzle 40 with the pressure sensor 44. In afurther embodiment, an error function may be initiated using the controlmodule 62 upon sensing no presence of the wafer carrier 15 with thepresence sensor 58 and further upon sensing flow between the gas port 38and the gas nozzle 40 with the pressure sensor 44, which could be anindication of malfunction of the wafer carrier purge apparatus 32.

While at least one exemplary embodiment has been presented in theforegoing detailed description of the invention, it should beappreciated that a vast number of variations exist. It should also beappreciated that the exemplary embodiment or exemplary embodiments areonly examples, and are not intended to limit the scope, applicability,or configuration of the invention in any way. Rather, the foregoingdetailed description will provide those skilled in the art with aconvenient road map for implementing an exemplary embodiment of theinvention. It being understood that various changes may be made in thefunction and arrangement of elements described in an exemplaryembodiment without departing from the scope of the invention as setforth in the appended claims.

What is claimed is:
 1. A wafer carrier purge apparatus comprising: a purge plate adapted for insertion into a carrier storage position, wherein the purge plate comprises: a body having a contact surface; a first protrusion extending outward from the body; a second protrusion extending outward from the body and substantially aligned with the first protrusion; a gas nozzle on the first protrusion and adapted to contact an inlet port of a wafer carrier for introducing gas into the wafer carrier; and a vacuum nozzle on the second protrusion and adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier, an alignment feature located on the contact surface of the body of the purge plate, wherein the alignment feature is linearly between the gas nozzle and the vacuum nozzle; wherein the purge plate is separate and removable from the carrier storage position.
 2. The wafer carrier purge apparatus of claim 1, wherein the gas nozzle is located on the contact surface of the purge plate that is adapted to contact the wafer carrier.
 3. The wafer carrier purge apparatus of claim 1, further comprising a presence sensor located on the contact surface for registering a presence or absence of the wafer carrier in the carrier storage position.
 4. The wafer carrier purge apparatus of claim 3, wherein the presence sensor comprises a photoelectric sensor.
 5. The wafer carrier purge apparatus of claim 3, wherein the purge plate comprises an integral structure connecting the gas nozzle and the presence sensor.
 6. The wafer carrier purge apparatus of claim 1, wherein the purge plate comprises a fastening feature to facilitate attachment of the purge plate to the carrier storage position.
 7. The wafer carrier purge apparatus of claim 1, further comprising a pressure sensor for monitoring flow of gas to the gas nozzle and the pressure sensor detects whether proper alignment of the gas and inlet port of the wafer carrier is achieved.
 8. The wafer carrier purge apparatus of claim 1, wherein the purge plate further comprises an alignment feature for aligning the inlet port of the wafer carrier with the gas nozzle.
 9. The wafer carrier purge apparatus of claim 8, wherein the purge plate comprises an integral structure connecting the gas nozzle and the alignment feature.
 10. The wafer carrier purge apparatus of claim 1, further comprising a control module and, a gas manifold in fluid communication with the gas nozzle, wherein the control module is adapted to control fluid flow in the gas manifold.
 11. The wafer carrier purge apparatus of claim 10, further comprising an additional purge plate, wherein the gas manifold is in fluid communication with the gas nozzle of the additional purge plate.
 12. The wafer carrier purge apparatus of claim 11, wherein the wafer carrier purge apparatus is free from shutoff valves disposed between the gas manifold and the gas nozzle.
 13. A wafer carrier purge apparatus comprising: a purge plate adapted for insertion into a carrier storage position, wherein the purge plate comprises: a body having a contact surface; a first protrusion extending outward from the body; a second protrusion extending outward from the body and substantially aligned with the first protrusion; a fastening feature shaped for attachment of the purge plate to the carrier storage position; a gas nozzle on the first protrusion and adapted to contact an inlet port of a wafer carrier for introducing gas into the wafer carrier; a vacuum nozzle on the second protrusion and adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier, an alignment feature located on the contact surface of the body of the purge plate, wherein the alignment feature is linearly between the gas nozzle and the vacuum nozzle; a presence sensor mounted on the contact surface of the body between the fastening feature and the alignment feature, wherein the presence sensor detects the carrier storage position; and a pressure sensor oriented perpendicularly with respect to the fastening feature, the presence sensor, and the alignment feature, the pressure sensor configured to monitor the flow of gas to the gas nozzle and to detect whether the gas port is aligned with the inlet port of the wafer carrier, wherein the purge plate is separate and removable from the carrier storage position.
 14. The wafer carrier purge apparatus of claim 13, wherein the presence sensor is located on the contact surface for registering a presence or absence of the wafer carrier in the carrier storage position.
 15. A wafer carrier purge apparatus comprising: a purge plate having a one piece construction adapted for insertion into a carrier storage position, wherein the purge plate comprises: a body having a contact surface; a first protrusion extending outward from the body; a second protrusion extending outward from the body and substantially aligned with the first protrusion; a gas nozzle on the first protrusion for introducing gas into the wafer carrier; a gas port for receiving a gas flow in fluid communication with the gas nozzle and adapted to contact an inlet port of a wafer carrier; a vacuum port on the second protrusion; a vacuum nozzle for removing gas from the wafer carrier and in fluid communication with the vacuum port; an alignment feature located on the contact surface of the body of the purge plate, wherein the alignment feature is linearly between the gas nozzle and the vacuum nozzle; and a channel separating the gas nozzle and vacuum nozzle, wherein the channel extends across the body between a first end and a second end, the second end is between the first protrusion and the second protrusion of the body, and wherein the second end is oriented perpendicularly with respect to the first end, wherein the purge plate is separate and removable from the carriage storage position. 